核心硬件
主板阵列箱（无屏无电池）
手机农场 · phone farm · 机架式硬件 · 广州工厂直供
无屏无电池 Android 主板阵列——最多 20 个 headless 节点，更低功耗与热量。
$1,824 USD参考目录价
网站 USD 为参考目录价，非最终成交价。书面 BOM / 形式发票确认后再付款。
Quote-first B2B — reference list price only. Written BOM, pro-forma invoice, freight, and payment terms are confirmed before you pay. No public checkout.
Procurement & Export
Factory-direct from Guangzhou — quote-first B2B
| MOQ | 1 unit |
|---|---|
| Lead time | 7–15 business days after motherboard fit check |
| Packing size | Approx. 48 × 32 × 16 cm export carton |
| Gross weight (packed) | Approx. 9–14 kg packed (chassis + PSU, boards client-supplied) |
| Voltage / power | 110–240V AC — industrial PSU approx. 550W class (config dependent) |
| Warranty | 12 months on chassis, PSU, fans, and USB harness |
| Shipping method | Express air from Guangzhou; anti-static internal packaging |
| Payment process | Fit check → quote → pro-forma → payment → assembly → burn-in → ship |
产品介绍
The Motherboard Box is built for screenless, battery-free mobile compute at scale. Up to twenty Android motherboard nodes mount in one cooled enclosure — phones engineered without displays or batteries for efficiency, longevity, and dense lab operation. Removing screens and batteries lowers per-node cost and thermal load while improving power efficiency compared with running full phones under continuous load. Each node keeps USB debugging access for ADB automation, remote Android control, app testing, and server-style workloads where display output is not required. Layout and board model must be confirmed before build — share your target motherboard SKU for a fit check.
核心特性
- —Screenless, battery-free node option
- —Up to 20 motherboard slots per chassis
- —Optimized airflow for dense headless load
- —Per-node USB debug access
- —Lower power draw vs full-phone arrays
- —Compatible with rack adapter or shelf mount
技术规格
| Node Type | Android motherboard (screenless) |
| Capacity | Up to 20 nodes |
| Chassis Size | 43.5 × 27.5 × 9 cm |
| PSU | Industrial 550W (config dependent) |
| Cooling | 4-fan internal array |
| Software Interface | ADB, scrcpy, group control tools |
| Mounting | Shelf or rack adapter (optional) |
应用场景
- Headless Android app testing at scale
- QA automation where UI display is not needed
- Cost-optimized device lab expansion
- Remote Android device control for backend services
询价前须知
适合
- +Headless Android app testing where display output is not required
- +Labs optimizing per-node cost and thermal load vs full-phone arrays
- +ADB-driven automation and remote Android control workflows
- +Teams with a confirmed motherboard SKU and dimensions ready for fit check
不适合
- —Campaign QA requiring on-device screen preview for ad display verification
- —iOS workloads — use iPhone Device Lab Array
- —Buyers without a confirmed motherboard model — fit cannot be guaranteed
- —First-time phone farm buyers who have not validated their board choice yet
典型交期：Standard layout for a previously verified board: 7–10 business days. New board fit check and custom frame: 10–15 business days after sample review.
产品 FAQ
Do you supply the motherboards?+
We supply the chassis and integration. Motherboard procurement can be quoted separately based on your target SoC and Android version.
Can full phones be used instead?+
This chassis is optimized for motherboard nodes. For full phones, use the Enterprise Phone Farm Box or Rackmount +20.
What is a motherboard phone farm box?+
A chassis that mounts screenless Android motherboard boards instead of full phones — same phone farm concept with lower power and heat for headless app testing and automation workloads.
包含配件
- • Motherboard mounting frames
- • PSU and internal power harness
- • USB debug harness per slot
- • Thermal pads and fan module
交付内容
- • Board fit confirmed before assembly
- • 7–15 day lead time for custom board layout
- • Export packaging with shock protection
维护
- • Inspect board connectors every 60 days
- • Replace thermal pads when re-seating boards